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| TCD2558D Preliminary TOSHIBA CCD Linear Image Sensor CCD (charge coupled device) TCD2558D The TCD2558D is a high sensitive and low dark current 5340 elements x 3 line CCD color image sensor which includes CCD drive circuit, clamp circuit. The sensor can be used for image scanner. The device contains a row of 5340 x 3 photodiodes, which provide a 24 lines/mm (600 dpi) across a A4 size paper. The divice is operated by 5 V (pulse), and 12 V power supply. Features * * * * * * * * * Number of image sensing elements: 5340 elements x 3 line Image sensing element size: 7 m by 7 m on 7 m centers Photo sensing region: High sensitive and low dark current PN photodiode Distance between photodiode array: 28 m, 4 line Clock: 2 phase (5 V) Power supply: 12 V power supply voltage Internal circuit: Clamp circuit Package: 22 pin CERDIP package Color filter: Red, green, blue Weight: 5.2 g (typ.) Pin Assignment (top view) 1 2002-12-25 TCD2558D Maximum Ratings (Note 1) Characteristics Clock pulse voltage Shift pulse voltage Reset pulse voltage Clamp pulse voltage Power supply Operating temperature Storage temperature Symbol VB VSH VRS VCP Rating Unit V -0.3~8 V V V VOD Topr Tstg -0.3~15 0~60 -25~85 V C C Note 1: All voltage are with respect to SS terminals (ground). Circuit Diagram 2 2002-12-25 TCD2558D Pin Names Pin No. 1 2 3 4 5 6 7 8 9 10 11 Symbol OS3 SS RS CP Name Signal Output 3 (red) Ground Reset Gate Clamp Gate Non Connection Non Connection Non Connection Clock 2 (phase 2) Clock 2 (phase 1) Shift Gate 3 Ground Pin No. 12 13 14 15 16 17 18 19 20 21 22 Symbol SH2 SH1 f1A1 f2A1 NC NC NC NC OD OS1 OS2 Shift Gate 2 Shift Gate 1 Clock 1 (phase 1) Clock 1 (phase 2) Non Connection Non Connection Non Connection Non Connection Power Name NC NC NC f2A2 f1A2 SH3 SS Signal Output 1 (blue) Signal Output 2 (green) Optical/Electrical Characteristics (Ta = 25C, VOD = 12 V, Vf = V f =V =V = 5 V (pulse), ff = 1 MHz, f = 1 MHz, f SH RS CP RS tINT = 10 ms, light source = light source A + CM500S filter (t = 1 mm), load resistance = 100 kW) W Characteristics Symbol RR Sensitivity RG RB PRNU (1) Photo response non uniformity PRNU (3) Image lag Saturation output voltage Saturation exposure Dark signal voltage Dark signal non uniformity DC power dissipation Total transfer efficiency Output impedance DC signal output voltage Random noise Reset noise IL VSAT SE VDRK DSNU PD TTE ZO VOS NDs VRSN Min 6.5 6.9 3.8 3/4 3/4 3/4 3.2 3/4 3/4 3/4 3/4 92 3/4 5 3/4 3/4 Typ. 9.3 9.9 5.4 10 3 1 3.5 0.35 0.5 5.0 430 3/4 0.1 6 0.8 0.5 Max 12.1 12.9 7.0 20 12 3/4 3/4 3/4 2.0 9.0 600 3/4 1.0 7 3/4 1.0 % mV % V Ixs mV mV mW % kW V mV V (Note 9) (Note 10) (Note 9) (Note 3) (Note 4) (Note 5) (Note 6) (Note 7) (Note 8) (Note 8) V /(lxs) (Note 2) Unit Note Note 2: Sensitivity is defined for each color of signal outputs average when the photosensitive surface is applied with the light of uniform illumination and uniform color temperature. 3 2002-12-25 TCD2558D Note 3: PRNU (1) is defined for each color on a single chip by the expressions below when the photosensitive surface is applied with the light of uniform illumination and uniform color temperature. PRNU (1) = Dc 100 (%) c When ? is average of total signal output and Dc is the maximum deviation from ?. The amount of incident light is shown below. Red = 1/2SE Green = 1/2SE Blue = 1/4SE Note 4: PRNU (3) is defined as maximum voltage with next pixel, where measured 5% of SE (typ.). Note 5: Image lag is defined as follows. Note 6: VSAT is defined as minimum saturation output of all effective pixels. Note 7: Definition of SE SE = VSAT (Ix x s) RG Note 8: VDRK is defined as average dark signal voltage of all effective pixels. DSNU is defined as different voltage between VDRK and VMDK when VMDK is maximum dark signal voltage. Note 9: DC signal output voltage is defined as follows. Reset noise voltage is defined as follows. 4 2002-12-25 TCD2558D Note 10: Random noise is defined as the standard deviation (sigma) of the output level difference between two adjacent effective pixels under no illumination (i.e. dark conditions) calculated by the following procedure. 1) 2) 3) Two adjacent pixels (pixel n and n + 1) in one reading are fixed as measurement points. Each of the output level at video output periods averaged over 200 ns period to get V (n) and V (n + 1). V (n + 1) is subtracted from V (n) to get DV. DV = V (n) - V (n + 1) 4) The standard deviation of DV is calculated after procedure 2) and 3) are repeated 30 times (30 readings). DV = 5) 6) 1 30 a | DVi | 30 i = 1 s= 1 30 2 a (| DVi | - DV ) 30 i = 1 Procedure 2), 3) and 4) are repeated 10 times to get sigma value. 10 sigma values are averaged. s= 1 10 a sj 10 j = 1 7) I value calculated using the above procedure is observed 2 times larger than that measured relative to the ground level. So we specify random noise as follows. NDs = 1 2 s Operating Condition Characteristics Clock pulse voltage "H" level "L" level "H" level Shift pulse voltage "L" level "H" level Reset pulse voltage "L" level "H" level Clamp pulse voltage "L" level Power supply voltage VCP VRS Symbol VfA Min 4.5 0.0 VfA "H" - 0.5 0.0 4.5 0.0 4.5 0.0 11.4 Typ. 5.0 3/4 VfA "H" 3/4 5.0 3/4 5.0 3/4 12.0 Max 5.5 0.5 VfA "H" 0.5 5.5 Unit V Note VSH V (Note 11) V 0.5 5.5 V 0.5 13.0 V VOD Note 11: VfA "H" means the high level voltage of VfA when SH pulse is high level. 5 2002-12-25 TCD2558D Clock Characteristics (Ta = 25C) Characteristics Clock pulse frequency Reset pulse frequency Clamp pulse frequency (bit clamp mode) Clock 1 capacitance Clock 2 capacitance Shift gate capacitance Reset gate capacitance Clamp gate capacitance (Note 12) (Note 12) Symbol ff fRS fCP Min 0.3 0.3 0.3 3/4 3/4 3/4 3/4 3/4 Typ. 1.0 1.0 1.0 140 120 20 10 10 Max 10 10 10 210 180 60 30 30 Unit MHz MHz MHz pF pF pF pF pF Cf1 Cf2 CSH CRS CCP Note 12: VOD = 12 V 6 2002-12-25 TCD2558D Timing Chart (bit CLAMP mode) 7 2002-12-25 TCD2558D Timing Chart (line CLAMP mode) 8 2002-12-25 TCD2558D Timing Requirements 9 2002-12-25 TCD2558D Timing Requirements Characteristics Pulse timing of SH and f1 SH pulse rise time, fall time SH pulse width Pulse timing of SH and CP Pulse timing of SH and CP (line clamp mode) f1, f2 pulse rise time, fall time RS pulse rise time, fall time RS pulse width Symbol t1 t5 t2, t4 t3 t6 t7 t8, t9 t10, t11 t12 t13 t14 t15, t16 (Note 14) t17 Min 120 800 0 3000 200 10 0 0 10 (25) 10 0 0 25 (3000) 3/4 Typ. (Note 13) Max 3/4 3/4 3/4 3/4 3/4 3/4 3/4 3/4 3/4 3/4 3/4 3/4 3/4 45 Unit ns ns ns ns ns ns ns ns ns ns ns ns ns 1000 1000 50 5000 500 100 50 20 80 20 20 20 80 (5000) 20 Pulse timing of RS and CP Pulse timing of f1A, f2A and CP CP pulse rise time, fall time CP pulse width Reference level settle time (bit clamp mode) t18 ns (Note 17) Video data delay time (Note 15) t19 3/4 45 20 (Note 16) ns 55 Reference level settle time (line clamp mode) t20 3/4 35 (Note 17) ns Note 13: Typ. is the case of fRS = 1.0 MHz Note 14: Line clamp mode inside ( ). Note 15: Load resistance is 100 kW Note 16: Typical settle time to about 1% of final value Note 17: Typical settle time to about 1% of the peak Clamp Mode Clamp Means Bit Clamp Line Clamp CP Input Pulse CP Pulse "H" or SH 10 2002-12-25 TCD2558D Typical Spectral Response 11 2002-12-25 TCD2558D Typical Drive Circuit IC1: TC74AC04 IC2: TC74HC04 TR1: 2SC1815-Y R1: 150 W R2: 1500 W 12 2002-12-25 TCD2558D Caution 1. Window Glass The dust and stain on the glass window of the package degrade optical performance of CCD sensor. Keep the glass window clean by saturating a cotton swab in alcohol and lightly wiping the surface, and allow the glass to dry, by blowing with filtered dry N2. Care should be taken to avoid mechanical or thermal shock because the glass window is easily to damage. 2. Electrostatic Breakdown Store in shorting clip or in conductive foam to avoid electrostatic breakdown. CCD Image Sensor is protected against static electricity, but interior puncture mode device due to static electricity is sometimes detected. When handling the device, it is necessary to execute the following static electricity preventive measures, in order to prevent the trouble rate increase of the manufacturing system due to static electricity. (1) Prevent the generation of static electricity due to friction by making the work with bare hands or by putting on cotton gloves and non-charging working clothes. Discharge the static electricity by providing earth plate or earth wire on the floor, door or stand of the work room. Ground the tools such as soldering iron, radio cutting pliers of or pincer. It is not necessarily required to execute all precaution items for static electricity. It is all right to mitigate the precautions by confirming that the trouble rate within the prescribed range. (2) (3) 3. Incident Light CCD sensor is sensitive to infrared light. Note that infrared light component degrades resolution and PRNU of CCD sensor. 4. Lead Frame Forming Since this package is not strong against mechanical stress, you should not reform the lead frame. We recommend to use a IC-inserter when you assemble to PCB. 5. Soldering Soldering by the solder flow method cannot be guaranteed because this method may have deleterious effects on prevention of window glass soiling and heat resistance. Using a soldering iron, complete soldering within ten seconds for lead temperatures of up to 260C, or within three seconds for lead temperatures of up to 350C. 13 2002-12-25 TCD2558D Package Dimensions Note 1: Top of chip to bottom of package. Note 2: Glass thickness (n = 1.5) Note 3: No.1 sensor element (S1) to edge of No.1 pin. Weight: 5.2 g (typ.) 14 2002-12-25 TCD2558D RESTRICTIONS ON PRODUCT USE 000707EBA * TOSHIBA is continually working to improve the quality and reliability of its products. Nevertheless, semiconductor devices in general can malfunction or fail due to their inherent electrical sensitivity and vulnerability to physical stress. It is the responsibility of the buyer, when utilizing TOSHIBA products, to comply with the standards of safety in making a safe design for the entire system, and to avoid situations in which a malfunction or failure of such TOSHIBA products could cause loss of human life, bodily injury or damage to property. In developing your designs, please ensure that TOSHIBA products are used within specified operating ranges as set forth in the most recent TOSHIBA products specifications. Also, please keep in mind the precautions and conditions set forth in the "Handling Guide for Semiconductor Devices," or "TOSHIBA Semiconductor Reliability Handbook" etc.. * The TOSHIBA products listed in this document are intended for usage in general electronics applications (computer, personal equipment, office equipment, measuring equipment, industrial robotics, domestic appliances, etc.). These TOSHIBA products are neither intended nor warranted for usage in equipment that requires extraordinarily high quality and/or reliability or a malfunction or failure of which may cause loss of human life or bodily injury ("Unintended Usage"). Unintended Usage include atomic energy control instruments, airplane or spaceship instruments, transportation instruments, traffic signal instruments, combustion control instruments, medical instruments, all types of safety devices, etc.. Unintended Usage of TOSHIBA products listed in this document shall be made at the customer's own risk. * The products described in this document are subject to the foreign exchange and foreign trade laws. * The information contained herein is presented only as a guide for the applications of our products. No responsibility is assumed by TOSHIBA CORPORATION for any infringements of intellectual property or other rights of the third parties which may result from its use. No license is granted by implication or otherwise under any intellectual property or other rights of TOSHIBA CORPORATION or others. * The information contained herein is subject to change without notice. 15 2002-12-25 |
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